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INTEGRATED CIRCUITS
DATA SHEET
TSA5055T 2.65 GHz bidirectional I2C-bus controlled synthesizer
Product specification Supersedes data of November 1991 File under Integrated Circuits, IC02 1999 Aug 11
Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
FEATURES * Complete 2.65 GHz single-chip system * Low power 5 V, 60 mA * I2C-bus programming * In-lock flag * Varicap drive disable * Low radiation * 5-level Analog to Digital Converter (ADC) * Address selection for Picture-In-Picture (PIP), DBS tuner, etc. * 6 controllable outputs, 4 bidirectional * Power-down flag * Available in SOT109-1 (SO16) package * Symmetrical or asymmetrical drive. APPLICATIONS * Satellite TV * High IF cable tuning systems. QUICK REFERENCE DATA SYMBOL VCC ICC fRF VI (rms) supply voltage supply current RF input frequency range input voltage level (RMS value) 1 to 1.8 GHz 1.8 to 2.65 GHz fXTAL zXTAL IO Tamb Tstg crystal oscillator frequency crystal oscillator impedance (absolute value) open-collector output current P7, P6, P5 and P4 output current P3 and P0 ambient temperature storage temperature 50 70 3.2 600 - - -20 -40 - - 4 1000 - 1 - - 300 300 PARAMETER - 1 MIN. 4.5 5 60 - TYP. GENERAL DESCRIPTION
TSA5055T
The TSA5055T is a single-chip PLL frequency synthesizer designed for satellite TV tuning systems. It may be used with a symmetrical input (pins 13 and 14) or with an asymmetrical input (pin 13). Control data is entered via the I2C-bus; five serial bytes are required to address the device, select the oscillator frequency, program the six output ports and set the charge-pump current. Four of these ports can also be used as input ports (three general purpose I/O ports, one ADC). Digital information concerning these ports can be read out of the TSA5055T on the SDA line (one status byte) during a READ operation. A flag is set when the loop is `in-lock' and is read during a READ operation. The device has one fixed I2C-bus address and three programmable addresses, programmed by applying a specific voltage to port 3. The phase comparator operates at 7.8125 kHz when a 4 MHz crystal is used.
MAX. 5.5 80 2.65 V
UNIT mA GHz mV mV MHz mA mA C C
4.48 - 10 - +85 +150
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TSA5055T SO16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm CODE SOT109-1
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RFIN1 RFIN2 13 14 PRESCALER 16 Q1 2 Q2 3 OSCILLATOR 4 MHz DIVIDER N = 512 7.8125 kHz fREF POWER DOWN DETECTOR IN-LOCK DETECTOR
BLOCK DIAGRAM
Philips Semiconductors
15-BIT PROGRAMMABLE DIVIDER
15-BIT LATCH DIVIDER RATIO
handbook, full pagewidth
2.65 GHz bidirectional I2C-bus controlled synthesizer
1 fDIV CHARGEPUMP 16
PD UD
DIGITAL PHASE COMPARATOR
TO
CP
LOGIC
TSA5055T
OS
3
SCL
5 I2C-BUS TRANSCEIVER
SDA
4
15
GND
ADDRESS SELECTION
3-BIT ADC
3 TTL LEVEL COMPARATORS
7-BIT LATCH PORT INFORMATION
LATCH 3 CONTROL DATA 12 VCC
GATE T1
11 P0
10 P3
9 P4
8 P5
7 P6
6
MBC307
Product specification
TSA5055T
P7
Fig.1 Block diagram.
Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
PINNING SYMBOL PD Q1 Q2 SDA SCL P7 P6 P5 P4 P3 P0 VCC RFIN1 RFIN2 GND UD PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION charge-pump output crystal oscillator input 1 crystal oscillator input 2 serial data input/output serial clock input port output/input (general purpose) port output/input (ADC) port output/input (general purpose) port output/input (general purpose) port output (also used for address selection) port output voltage supply RF signal input 1 RF signal input 2 (decoupled) ground drive output
handbook, halfpage
TSA5055T
PD 1 Q1 2 Q2 3 SDA 4
16 UD 15 GND 14 RFIN2
TSA5055T
SCL 5 P7 6 P6 7 P5 8
MBC304
13 RFIN1 12 VCC 11 P0 10 P3 9 P4
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION General The TSA5055T is controlled via the 2-wire I2C-bus. For programming, there is one (7-bit) module address and the R/W bit for selecting READ or WRITE mode. WRITE mode: R/W = 0; see Table 1 After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are needed to fully program the TSA5055T. The bus transceiver has an auto-increment facility that permits the programming of the TSA5055T within one single transmission (address + four data bytes). The TSA5055T can also be partly programmed on the condition that the first data byte following the address is byte 2 or byte 4.
The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted indicates whether frequency data (first bit = 0) or charge-pump and port information (first bit = 1) will follow. Until an I2C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the device. This allows a smooth frequency sweep for fine tuning. At power-on, the ports are set to the high-impedance state. The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512. Because the input of the RF signal is first divided by 16, the step size is 125 kHz. A 3.2 MHz crystal can offer a step size of 100 kHz.
1999 Aug 11
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
Table 1 Write data format; see notes 1 to 13 BYTE Address Programmable divider Charge-pump and test bits Output ports, control bits Notes 1. MA1 and MA0: programmable address bits (see Table 3). 2. A: Acknowledge bit. 3. N14 to N0: programmable divider bits. 4. N = N14 x 214 + N13 x 213 + ... + N1 x 21 + N0. 5. CP: charge-pump current. CP = 0: 50 A; CP = 1: 220 A. 6. P7 to P4 = 1: open-collector outputs are active. 7. P7 to P3 and P0 = 0: outputs are in high-impedance state. 8. P3 and P0 = 1: current-limited outputs are active. 9. T1, T0 and OS = 0, 0 and 0: normal operation. 10. T1 = 1: P6 = fREF and P7 = fDIV. 11. T0 = 1: 3-state charge-pump. 12. OS = 1: Operational amplifier output is switched off (varicap drive disable). 13. X: don't care. READ mode: R/W = 1; see Table 2 Data can be read out of the TSA5055T by setting the R/W bit to 1. After the slave address has been recognized, the TSA5055T generates an Acknowledge signal (A) and the first data byte (status byte) is transferred to the SDA line (MSB first). Data is valid on the SDA line while the SCL clock signal is HIGH. A second data byte can be read out of the TSA5055T if the processor generates an Acknowledge signal on the SDA line. End of transmission will occur if the processor does not send an Acknowledge signal. MSB 1 0 N7 1 P7 1 N14 N6 CP P6 0 N13 N5 T1 P5 DATA BYTE 0 N12 N4 T0 P4 0 N11 N3 1 P3 MA1 N10 N2 1 X MA0 N9 N1 1 X LSB 0 N8 N0 OS P0
TSA5055T
COMMAND A A A A A byte 1 byte 2 byte 3 byte 4 byte 5
The TSA5055T will then release the data line to allow the processor to generate a STOP condition. When ports P3 to P7 are used as inputs, they must be programmed to their high-impedance state. The POR flag (Power-On Reset) is set to 1 at power-on and when VCC goes below 3 V. The flag is reset when an end of data is detected by the TSA5055T (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL, which indicates when the loop is phase-locked (FL = 1).
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
Table 2 Read data format (see notes 1 to 5) BYTE Address Status byte Notes 1. POR: Power-on reset flag (POR = 1 on power-on). 2. FL: in-lock flag (FL = 1 when the loop is phase-locked). 3. I2, I1 and I0: digital information for I/O ports P7, P5 and P4 respectively. 4. A2, A1 and A0: digital outputs of the 5-level ADC. Accuracy is 12 LSB (see Table 4). 5. MSB is transmitted first. MSB 1 POR 1 FL 0 I2 DATA BYTE 0 I1 0 I0 MA1 A2 MA0 A1 LSB 1 A0 A -
TSA5055T
COMMAND byte 1 byte 2
Bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4, respectively. A logic `0' indicates a LOW level and a logic `1' a HIGH level (TTL levels). A built-in 5-level ADC is available at I/O port P6. This ADC can be used to feed AFC information to the controller from the IF section of the receiver, as shown in Fig.4. The relationship between bits A2, A1, A0 and the input voltage at port P6 is given in Table 4. Table 3 Address selection MA0 0 1 0 1 0 to 0.1VCC always valid 0.4VCC to 0.6VCC 0.9VCC to 13.5 V VOLTAGE APPLIED ON PORT P3
MA1 0 0 1 1
Address selection; see Table 3 The module address contains programmable address bits (MA1 and MA0), which offer the possibility of having several synthesizers (up to three) in one system. The relationship between MA1 and MA0 and the input voltage at port P3 is given in Table 3. Table 4 A2 1 0 0 0 0 ADC levels A1 0 1 1 0 0 A0 0 1 0 1 0 0.6VCC to VCC 0.45VCC to 0.6VCC 0.3VCC to 0.45VCC 0.15VCC to 0.3VCC 0 to 0.15VCC VOLTAGE APPLIED ON PORT P6
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
TSA5055T
handbook, full pagewidth
+12 V +5 V IF signal IF SECTION AFC OUTPUT P0 P3 P4 9 SATELLITE MIXER OSCILLATOR PART 10 11 12 1 nF oscillator outputs 13 1 nF 14 0.1 F 15 16 varicap VT input 3 18 pF 2 1 180 nF 39 nF 8 P6 7 6 5 P7 SCL I2C-bus 4 4 MHz SDA MICROCONTROLLER P5
TSA5055T
+33 V 22 k BC847B
22 k
FCE048
Fig.3 Symmetrical application diagram.
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
TSA5055T
handbook, full pagewidth
+12 V +5 V IF signal IF SECTION AFC OUTPUT P0 P3 P4 9 SATELLITE MIXER OSCILLATOR PART 10 11 12 oscillator output 1 nF 13 14 10 nF 0.1 F 15 16 varicap VT input 2 1 180 nF 39 nF 8 P6 7 6 5 P7 SCL I2C-bus 4 4 MHz 3 18 pF SDA MICROCONTROLLER P5
TSA5055T
+33 V 22 k BC847B
22 k
FCE049
Fig.4 Asymmetrical application diagram.
1999 Aug 11
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC VO(PD) VI(Q1) VI/O(SDA) VI(SCL) VI/O(P7-P0) VI(RFIN) VO(UD) IO(P4-P7) IO(SDA) Tstg Tj HANDLING All pins withstand the ESD test in accordance with "MIL-STD-883C", category A (1000 V). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER from junction to ambient CONDITIONS in free air VALUE 110 supply voltage charge-pump (PD) output voltage crystal (Q1) input voltage serial data (SDA) input/output voltage serial clock (SCL) input voltage input/output ports (P7 to P3 and P0) voltage prescaler inputs (RFIN1 and RFIN2) voltage drive output (UD) voltage output ports (P7 to P4) current (open-collector) serial data (SDA) output current (open-collector) storage temperature maximum junction temperature PARAMETER MIN. -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -1 -1 -40 -
TSA5055T
MAX. +6 VCC VCC +6 +6 +16 +2.5 VCC +15 +5 +150 150 V V V V V V V V
UNIT
mA mA C C
UNIT K/W
CHARACTERISTICS VCC = 5 V; Tamb = 25 C; unless otherwise specified. SYMBOL VCC Tamb fRF N ICC fXTAL ZXTAL VXTAL(p-p) PARAMETER supply voltage range ambient temperature RF input frequency range divider ratio supply current crystal oscillator frequency crystal oscillator impedance (pin 2) drive level on pin 2 (quartz Philips 4322 143 04093) (peak-to-peak value) input voltage level (RMS value) f = 1 to 1.8 GHz f = 1.8 to 2.65 GHz RI CI prescaler input impedance input capacitance 9 VCC = 4.5 to 5.5 V; Tamb = -20 to +85 C; see typical sensitivity curve in Fig.5 see Smith chart in Fig.6 absolute value CONDITIONS MIN. 4.5 -20 1 256 - 3.2 600 - TYP. 5 - - - 60 4 1000 110 MAX. 5.5 +85 2.65 32767 80 4.48 - - mA MHz mV V C GHz UNIT
VI(rms)
50/-13 70/-10 - -
- - 50 2
300/2.6 mV/dBm 300/2.6 mV/dBm - - pF
1999 Aug 11
Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
SYMBOL PARAMETER CONDITIONS - 0.7 - - - -10 2.7 - VIH = 13.5 V VIL = 0 V - -10 3 - VIH = 5 V; VCC = 0 V VIH = 5 V; VCC = 5 V IIL input current LOW VIL = 0 V; VCC = 0 V VIL = 0 V; VCC = 5 V Output SDA (open-collector) IOH VOL IOH IOL VO IO(leak) VO hFE leakage current output voltage VOH = 5.5 V IOL = 3 mA - - 90 22 1.5 -5 - - 2000 - - 220 50 - - - - - - - -10 -10 MIN. TYP. - 1 - - - - - - - - - - - - - -
TSA5055T
MAX.
UNIT A mA A V A A V V A A V V A A A A A V A A V nA
Output ports P3 and P0 (current limited) ILO IOS ILO VOL IIH IIL VIH VIL IIH IIL VIH VIL IIH leakage current output sink current Vo = 13.5 V Vo = 13.5 V Vo = 13.5 V Io = 10 mA; note 2 VIH = 13.5 V VIL = 0 V 10 1.5
Output ports P7 to P4 (open collector); see note 1 leakage current output voltage LOW 10 0.7
Input ports P6 and P3 input current HIGH input current LOW 10 - - 0.8 10 - 5.5 1.5 10 10 - - 10 0.4
Input ports P7, P5 and P4 input voltage HIGH input voltage LOW input current HIGH input current LOW
Bus inputs SCL and SDA input voltage HIGH input voltage LOW input current HIGH
Charge-pump output PD output current HIGH (absolute value) CP = 1 output current LOW (absolute value) output voltage off-state leakage current CP = 0 in-lock T0 = 1 300 75 2.5 +5
Operational amplifier output UD (test mode: T0 = 1) output voltage output voltage when switched off operational amplifier current gain I O ( UD ) ---------------------------------------------I O ( PD ) - I O ( PD leak ) Notes 1. When a port is active, the collector voltage must not exceed 6 V. 2. Measured with a single open-collector active. VO(PD) = 0 V T0 = 1; OS = 1; VO(PD) = 2 V T0 = 1, OS = 0; VO(PD) = 2 V IO(UD) = 10 A 100 250 - mV mV
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
TSA5055T
FCE060
9 handbook, halfpage Vi (dBm) -3 guaranteed operating area -10 dBm -15
-27
-39
0
800
1600
2400
2650
3200 f (MHz)
VCC = 5 V; Tamb = 25 C.
Fig.5 Typical input sensitivity curve.
1
handbook, full pagewidth
0.5
2
0.2 2.65 GHz +j 0 -j 0.2 0.5 2 GHz 1 2 5 10
5 10
10
0.2 1 GHz
5
0.5 1 VCC = 5 V; reference value = 50 .
2
FCE061
Fig.6 Smith chart of typical input impedance.
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
FLOCK FLAG DEFINITION (FL) When the FL flag is 1, the maximum frequency deviation (f) from stable frequency can be expressed as follows: K VCO C1 + C2 f = ------------- x I CP x --------------------- KO C1 x C2 where: KVCO = oscillator slope (Hz/V) ICP = charge-pump current (A) KO = 4 x 106 C1 and C2 = loop filter capacitors. Flock flag settings PARAMETER Time span between actual phase lock and FL-flag setting Time span between the loop losing lock and FL-flag resetting Flock flag application * KVCO = 50 MHz/V * ICP = 220 A * C1 = 180 nF * C2 = 39 nF * f = 85.8 kHz. 1024 0 MIN. 1152 128 MAX. Fig.7 Loop filter.
handbook, halfpage
TSA5055T
C2 C1 R
MGA032
UNIT s s
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
EQUIVALENT INPUT CIRCUITS
TSA5055T
VCC Vref
Vref
1 600 RFIN1 13 RFIN2 14 OS
FCE051
PD
600
200
170 16 UD
FCE052
Fig.8 RF input amplifier.
Fig.9 Current amplifier.
VCC
(2)
VCC
6-11
(2) (1) (2)
1 k SDA 4
FCE053
FCE054
(1) This resistor is implemented only for P0 and P3. (2) These components are not implemented for P0.
Fig.10 Input/output ports, pins 6 to 11.
Fig.11 I2C SDA.
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
TSA5055T
VCC VCC Q2 3
1 k SCL 5 Q1
FCE055 FCE056
2
Fig.12 I2C SCL.
Fig.13 Reference oscillator.
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm
TSA5055T
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
TSA5055T
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not
TSA5055T
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TSA5055T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
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Philips Semiconductors
Product specification
2.65 GHz bidirectional I2C-bus controlled synthesizer
NOTES
TSA5055T
1999 Aug 11
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/25/03/pp20
Date of release: 1999
Aug 11
Document order number:
9397 750 05009

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